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2016/12/29 (Thursday)

	Status: IVC open, tower removed. Main bath vacuum jacket is evacuated. 1K Pot needle valve closed. LN2 traps clean. Mixture is in dump, fridge evacuated.
1100	Remove S101 from purge cabinet
1125	Remove S101 from bag in wirebonding lab
1140	Finish rebonding the broken connection, DIB4 Side 2 Pin 4. Matt C had an elaborate hopscotching wiring on this DIB, using surgically isolated stadiums and unused bonding pads… it worked until one bond broke. I did a direct, long bond from Pin 4 to the tes6 pad.
1210	There were shorts on DIB4 Side 2. First there was a few kΩ short to chassis. Pushing wires around a little helped get rid of this, but the new bond on Pin 4 was causing a short between Pins 2 and 3 (a few Ω). Eventually I pushed it around enough to remove this short but the short to chassis returned. This is clearly a contact with the Side 1 lid, so maybe it won't be a problem when this is removed (and replaced with the source holder). But I'll have to decide whether this is a problem, whether to redo the bond (and maybe redo all the bonds on this DIB side??).
1215	Put S101 back in bag
1325	Remove S101 from bag in cleanroom
1335	While trying to push around the wires on DIB4 side2, broke one of the Pin1 bonds (the second leg in the hopscotch). So this will need to be redone. Contemplating whether to start over with all four.
	Shorts between Pins 2 and 3 are still showing up independent of the Pin4 wire. Fiddling around with some of the short segments I got rid of the short but may have destroyed the Pin2 connection. Will need to figure out how to redo this DIB side.
1345	Put S101 in purge
1405	Remove S101 from purge, inspect in clean room, put in bag for transport to wirebonder lab

1430	Remove S101 from bag in wirebonder lab
1500	Finish fixes on DIB4 Side 2, put S101 back in bag
	The fixes are as follows: first off, Matt C had performed surgery to produce isolated stadiums near the DIB pads, and also to isolate the two bond pads for tes8 to produce spare pads. I removed the Pin 3 wires, and replaced with a long direct bond. So Pin 3 and Pin 4 are both long and direct. At first these two wires were touching and producing a short but pushing them around a bit got rid of the short. Then for Pins 1 and 2, there were still intact bonds from DIB to the stadium pads, and also from the spare pads to the tes7 pads. So I simply made new bonds from the stadiums to the spare pads to complete these three-leg hopscotch bonds. In the end the two connected channels seemed to be reading correct resistances with no shorts between them and no shorts to chassis.
1530	Move S101 into cleanroom for electrical check
1535	Electrical checkout is good. All measurements the same as yesterday except DIB4pB reads 417 Ω, and all DIB4 pins to chassis are less than 0.1 nS
1535	Return S101 to purge cabinet

1655	Finish drilling hole through back of rightmost fridge bath port, the one that generally isn't used.