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2016/12/28 (Wednesday)

Previous Day

Status: IVC open, tower removed. Main bath vacuum jacket is evacuated. 1K Pot needle valve closed. LN2 traps clean. Mixture is in dump, fridge evacuated.

S101 rewiring plan:

1 side1 dib1 pB bond to TES3 (long bonds)
2 side1 dib1 pD remove bonds to TES2
3 side1 dib1 pC bond to TES2 (long bonds)
4 side1 dib3 pC redo pin6 bond to TES5
5 side2 dib1 pB remove bonds to tes10
6 side2 dib1 pC remove bonds to tes9
7 side2 dib1 pD bond to tes9 and jump tes10 to tes9
8 side2 dib3 pA remove bonds to tes11
9 side2 dib3 pA bond to tes8, which requires surgery
10 side2 dib3 pB bond to tes11
1015 Receive two 241Am sources from Berkeley. The larger one has a Be window, bag is labeled SS130, 0.5 uCi. For this one Matt P was not sure whether the window would allow the lower x-ray lines through. The smaller one is a smoke detector source, bag labeled EH&S#990, 1 uCi. As I understand it these are totally unshielded so that the alphas also come through unless we block them with something (thin foil).
We have 1.7 mil thick Al foil = 43 um. Al stopping power for 10keV x-rays is 25 cm2/g, density 2.7 g/cm3, mean free path then is 148 um, so 43 um foil lets 75% of 10keV x-rays through. (Smallest 241Am x-ray is 13 keV.)
1110 Remove S101 from purge cabinet to take up to wirebonding lab
Wirebonder settings (buffer #23): Bond 1/2 Power = 480/480, Bond Times = 40/30, loop height = 50 mils, drop before clamp = 26 mils
1125 Remove S101 from bag in wirebonding lab
1135 Finish Step 4, redo DIB3pC pin6 bond to TES5. This channel previously read open, now is continuous (but resistance is a little lower than normal)
1145 Finish Step 1, bond DIB1pB to TES3. After completing this the resistance check showed DIB1pA reading only about 4 Ω, because the pin3 bond was in contact with the pA bonds and shorting them. I pushed the wire away a bit and it fixed this problem. But it may come back.
1150 Finish Step 2, remove DIB1pD bonds to TES2
1200 Finish Step 3, bond DIB1pC to TES2
1205 DIB1 and DIB3 channels on side 1 show continuity. Put S101 back in bag, Side 1 bonding fixes are finished.
1355 Remove S101 from bag in wirebonding lab again
1405 Finish Steps 5 & 6, remove existing tes9&10 bonds
1440 Finish Step 7, bond DIB1pD to tes9, then jump tes10 to tes9
1540 Finish Steps 8,9 and 10. Did surgery on one stadium in the 6th row counting in from the outside, and another stadium in the 7th row, on each stadium removing its connection to the rail on the side toward the center. This was done using the wirebonder microscope and carefully scraping with the tip of a hypodermic needle. These formed the two bond pads for tes8.
1555 Put S101 back in bag
what Matt Cherry sent
pA pB pC pD
DIB1 TES4 tes10 tes9 TES2
DIB3 tes11 (R very high) n/c TES5 (open) n/c
DIB4 tes7 tes6 TES1 TES0
tes8 and TES3 not connected
New wiring
pA pB pC pD
DIB1 TES4 TES3 TES2 tes9(-tes10)
DIB3 tes8(d4) tes11 TES5 n/c
DIB4 tes7 tes6 TES1 TES0
1635 Bring S101 into clean room
Detector S101 DIB 1
date/who: 2016-12-28 MF
+lead - lead signal typical measured
1 2 QET A 100 to 200 Ω 301 Ω
3 4 QET B 100 to 200 Ω 107 Ω
5 6 QET C 100 to 200 Ω 392 Ω
7 8 QET D 100 to 200 Ω 287 Ω
9 chassis LED1 Rforward 8 to 9 MΩ 73 kΩ
9 chassis LED1 Vforward 1.0 to 1.1 V 0.985 V
chassis 9 LED1 Rreverse <1 nS 250 kΩ
10 chassis LED2 Rforward 8 to 9 MΩ 767 kΩ
10 chassis LED2 Vforward 1.0 to 1.1 V 1.045 V
chassis 10 LED2 Rreverse <1 nS <0.3 nS
11 12 Qo-Qi n/a
12 11 Qi-Qo n/a
1-8 chassis <1 nS <0.1 nS
Detector S101 DIB 3
date/who: 2016-12-28 MF
+lead - lead signal typical measured
1 2 QET A 100 to 200 Ω 131 Ω
3 4 QET B 100 to 200 Ω 26 Ω
5 6 QET C 100 to 200 Ω 27 Ω
7 8 QET D 100 to 200 Ω open
9 chassis LED1 Rforward 8 to 9 MΩ open
9 chassis LED1 Vforward 1.0 to 1.1 V open
chassis 9 LED1 Rreverse <1 nS open
10 chassis LED2 Rforward 8 to 9 MΩ open
10 chassis LED2 Vforward 1.0 to 1.1 V open
chassis 10 LED2 Rreverse <1 nS open
11 12 Qo-Qi n/a
12 11 Qi-Qo n/a
1-8 chassis <1 nS <0.11 nS
Detector S101 DIB 4
date/who: 2016-12-28 MF
+lead - lead signal typical measured
1 2 QET A 100 to 200 Ω 349 Ω
3 4 QET B 100 to 200 Ω 420 Ω open
5 6 QET C 100 to 200 Ω 347 Ω
7 8 QET D 100 to 200 Ω 378 Ω
9 chassis LED1 Rforward 8 to 9 MΩ open
9 chassis LED1 Vforward 1.0 to 1.1 V open
chassis 9 LED1 Rreverse <1 nS open
10 chassis LED2 Rforward 8 to 9 MΩ open
10 chassis LED2 Vforward 1.0 to 1.1 V open
chassis 10 LED2 Rreverse <1 nS open
11 12 Qo-Qi n/a
12 11 Qi-Qo n/a
1-8 chassis <1 nS <0.4 nS

QET B was ok when first checked, but after opening, taking photos, and closing again, it reads open.

DIB1 Side 1 DIB3 Side 1
Here I left Matt C's complicated hop-scotch
bonds from pA to TES4. I added bonds from
pB to TES3. One of these bonds was in contact
with the pA bonds and caused a short, until
I pushed the wire out of the way. The pD-TES2
bonds were removed and replaced with pC-TES2.
Here I simply replaced the bond from
pin 6 (pC) to TES5. Previously this channel
was reading open - now it reads
unusually low at 27 Ω.
DIB1 Side 2 DIB3 Side 2
Here the pB-tes10 and pC-tes9 bonds were
removed, and pD-tes9 was bonded, and
tes10 was shorted to tes9
pA-tes11 was removed, and pB-tes11 was
bonded instead. pA-tes8 was bonded using
two stadiums with surgery to remove the
connections on one side. tes8 is showing
an ordinary resistance but tes11 is, like
TES5, reading unusually low at 26 Ω.

Interestingly the two outer ring channels, tes11 and TES5, are reading very low resistances. This was not seen in Matt Cherry's original wiring, which seems to be a coincidence, since both of these were reading open or nearly so, so they must have had poor connections. One of Matt C's originals was a complicated hop-scotch bond. Now both bonds are direct and not long and are not in danger of shorting with other bonds. So the low resistance of these channels seems to be real.

There are also two channels that are somewhat lower than the others, both a little above 100 Ω - and these turn out to be the B-ring channels, the second-to-outermost channels. So there is a clear pattern here - the outer ring channels have lower resistances. And the trend continues to the center, because the two center channels are almost the highest resistances.

Position Resistance [Ω]
A-ring (outermost) 26, 27
B-ring 107, 131
inner ring 287, 301, 347, 392, 392
center 378, 420
DIB4 Side 2
I didn't do any modifications on this one,
but the pin4 bond broke during handling.
It will need to be fixed. Unfortunately
this is a “hop-scotch” bond, it may be
difficult for me to fix it.
1710 Return S101 to purge cabinet

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